Plasma technologies

Push the limits of material processing with CORIAL’s plasma-based technologies that enable the manufacture of next generation devices for specialty semiconductor markets.

RIE technology

RIE

Simple-to-operate equipment for etching a wide range of materials with moderate etch rates.

ICP-RIE technology

ICP-RIE

Available processes span from low damage etching to rapid etching of hard materials.

DRIE technology

DRIE

High etch rate, excellent profile control, and high selectivity for etch depth greater than 100 µm.

ICP-CVD technology

ICP-CVD

Technology for film deposition on-to temperature and/or damage-sensitive substrates.

PECVD technology

PECVD

Uniform deposition of thin films (Si, SiO2, Si3N4, etc.), with excellent control of material properties.

ALE technology

ALE

Etch technology enabling the controlled removal of material from a substrate, layer-by-layer.

ALD technology

ALD

Highly conformal coatings for MEMS applications, and semiconductor devices.