Push the limits of material processing with CORIAL’s plasma-based technologies that enable the manufacture of next generation devices for specialty semiconductor markets.
Simple-to-operate equipment for etching a wide range of materials with moderate etch rates.
Available processes span from low damage etching to rapid etching of hard materials.
High etch rate, excellent profile control, and high selectivity for etch depth greater than 100 µm.
Technology for film deposition on-to temperature and/or damage-sensitive substrates.
Uniform deposition of thin films (Si, SiO2, Si3N4, etc.), with excellent control of material properties.
Etch technology enabling the controlled removal of material from a substrate, layer-by-layer.
Highly conformal coatings for MEMS applications, and semiconductor devices.